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Effect of current flow on bipolar plate/gas diffusion layer interfacial contact resistance in Proton Exchange Membrane fuel cells (PEMFC)

机译:电流对质子交换膜燃料电池(PEMFC)中双极板/气体扩散层界面接触电阻的影响

摘要

Stainless steel bipolar plates can be excellent alternative to graphite bipolar plates since they display better mechanical properties and the manufacturing procedure is easier and cheaper. However, they are chemically instable in the corrosive environment of PEMFCs, and a thin oxide layer is developed on the plate’s surface. This layer causes a significant increase in the interfacial contact resistance (ICR) between the plates and gas diffusion layers. In an effort to characterize various stainless steel samples, before and after their exposure to the corrosive environment of a PEMFC, the interfacial contact resistance (ICR) between the plates and a commercial gas diffusion layer (GDL) was studied as a function of the pressure applied on the assembly. The ICR was studied in the range of 0-500 N/cm2 of pressure applied to the assembly; the ICR value was determined by means of galvanostatic potentiometry, where a constant current is applied to the assembly and the average value of the potential over time is recorded. The ICR is then calculated, after appropriate simplifications, as:ICR = Rtot = Iapplied / Vmonitored (1)It was observed that, besides the expected exponential reduction of ICR versus pressure, the value of the current applied to the assembly impacted greatly the obtained values for the ICR, irrespective of the applied pressure. This indicates that the observed phenomenon is not caused by any morphological changes on the interface. A possible explanation is that, at higher currents, the temperature increases locally due to ohmic heating, inducing thus changes in the GDL’s resistivity.
机译:不锈钢双极板可以替代石墨双极板,因为它们显示出更好的机械性能,并且制造过程更容易,更便宜。但是,它们在PEMFC的腐蚀环境中化学不稳定,并且在印版表面上会形成一层薄氧化层。该层使板和气体扩散层之间的界面接触电阻(ICR)大大增加。为了表征各种不锈钢样品,在将它们暴露于PEMFC的腐蚀性环境之前和之后,研究了板和商用气体扩散层(GDL)之间的界面接触电阻(ICR)与压力的关系。应用于装配体。在施加到组件的压力为0-500 N / cm2的范围内研究了ICR; ICR值是通过恒流电位计确定的,其中向组件施加恒定电流,并记录随时间变化的电位平均值。然后,经过适当简化,ICR的计算公式如下:ICR = Rtot =施加/监测(1)观察到,除了预期的ICR随压力的指数下降外,施加到组件上的电流值对所得结果也有很大影响。 ICR值,与施加的压力无关。这表明观察到的现象不是由界面上的任何形态变化引起的。可能的解释是,在较高电流下,由于欧姆加热,温度会局部升高,从而导致GDL的电阻率发生变化。

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